带浮动电极的微机电系统开关的性能计算

Q4 Engineering
M. O. Morozov, I. V. Uvarov
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引用次数: 0

摘要

摘要 利用微机电系统技术制造的开关被认为是无线电电子学中一种前景广阔的元件基础。微机电系统开关的主要特点是闭合和打开状态下的电容比。对于传统器件来说,这一比率为几个单位,但通过采用独创的设计方案,这一比率可以显著提高。本文研究的开关是电容和电阻器件的组合。它的工作特性取决于基底特性和接触电阻。当使用蓝宝石和硼硅玻璃基底时,开关的电容比分别为 27.7 和 46.1,而高电阻率硅由于寄生电容较高,其电容比无法达到 7.4 以上。在蓝宝石晶片上,4-10 千兆赫频率范围内的隔离度和插入损耗分别为 14.7-19.4 分贝和 0.8-1.1 分贝。当接触电阻不高于 1 Ω 时,可获得可接受的 S 参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Performance Calculation for a MEMS Switch with a Floating Electrode

Performance Calculation for a MEMS Switch with a Floating Electrode

Abstract

Switches fabricated using MEMS technology are considered as a promising element base of radio electronics. The main characteristic of a MEMS switch is the ratio of capacitances in the closed and open states. For conventional devices, this ratio is of several units, but it can be significantly increased by implementing original design solutions. This paper studies the switch, which is a combination of capacitive and resistive devices. Its working characteristics are considered depending on the substrate properties and contact resistance. The switch provides a capacitance ratio of 27.7 and 46.1 when using sapphire and borosilicate glass substrates, while high-resistivity silicon does not allow attaining values above 7.4 due to the high parasitic capacitance. The isolation and insertion loss are 14.7–19.4 and 0.8–1.1 dB in the frequency range of 4–10 GHz on a sapphire wafer. Acceptable S-parameters are achieved when the contact resistance is not higher than 1 Ω.

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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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