第 28 届电气和电子工程师学会欧洲测试研讨会

IF 1.9 4区工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Design & Test Pub Date : 2024-01-17 DOI:10.1109/mdat.2023.3292800

Naghmeh Karimi

{"title":"第 28 届电气和电子工程师学会欧洲测试研讨会","authors":"Naghmeh Karimi","doi":"10.1109/mdat.2023.3292800","DOIUrl":null,"url":null,"abstract":"The 28th IEEE European Test Symposium (ETS) was held in Venice, Italy, 22–26 May 2023, in a hybrid format. This was the second hybrid venue for ETS since the COVID-19 pandemic. ETS is Europe’s premier forum in the area of electronic-based circuits and system testing, reliability, security, and validation. ETS’23 was arranged in five days and the program consisted of keynotes, scientific paper presentations, panels, workshops, highlights/demos from the industry, a PhD forum, and a McCluskey contest. It also included the Test Spring School (TSS). A total of 238 attendees (including both in-person and virtual) registered for the conference from 36 countries among which 102 were from industry and 135 were affiliated with academia (including 53 students).","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"5 1","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2024-01-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The 28th IEEE European Test Symposium\",\"authors\":\"Naghmeh Karimi\",\"doi\":\"10.1109/mdat.2023.3292800\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The 28th IEEE European Test Symposium (ETS) was held in Venice, Italy, 22–26 May 2023, in a hybrid format. This was the second hybrid venue for ETS since the COVID-19 pandemic. ETS is Europe’s premier forum in the area of electronic-based circuits and system testing, reliability, security, and validation. ETS’23 was arranged in five days and the program consisted of keynotes, scientific paper presentations, panels, workshops, highlights/demos from the industry, a PhD forum, and a McCluskey contest. It also included the Test Spring School (TSS). A total of 238 attendees (including both in-person and virtual) registered for the conference from 36 countries among which 102 were from industry and 135 were affiliated with academia (including 53 students).\",\"PeriodicalId\":48917,\"journal\":{\"name\":\"IEEE Design & Test\",\"volume\":\"5 1\",\"pages\":\"\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-01-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Design & Test\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/mdat.2023.3292800\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2023.3292800","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}

引用次数: 0

摘要

第 28 届电气和电子工程师学会欧洲测试研讨会（ETS）于 2023 年 5 月 22 日至 26 日在意大利威尼斯以混合形式举行。这是自 COVID-19 大流行以来，ETS 第二次以混合形式举办。ETS 是欧洲电子电路和系统测试、可靠性、安全性和验证领域的顶级论坛。ETS'23 会议为期五天，内容包括主题演讲、科学论文报告、小组讨论、研讨会、行业亮点/演示、博士论坛和麦克卢斯基竞赛。会议还包括春季测试学校（TSS）。共有来自 36 个国家的 238 名与会者（包括现场和虚拟与会者）注册参会，其中 102 人来自工业界，135 人来自学术界（包括 53 名学生）。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

The 28th IEEE European Test Symposium

The 28th IEEE European Test Symposium (ETS) was held in Venice, Italy, 22–26 May 2023, in a hybrid format. This was the second hybrid venue for ETS since the COVID-19 pandemic. ETS is Europe’s premier forum in the area of electronic-based circuits and system testing, reliability, security, and validation. ETS’23 was arranged in five days and the program consisted of keynotes, scientific paper presentations, panels, workshops, highlights/demos from the industry, a PhD forum, and a McCluskey contest. It also included the Test Spring School (TSS). A total of 238 attendees (including both in-person and virtual) registered for the conference from 36 countries among which 102 were from industry and 135 were affiliated with academia (including 53 students).

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

3.80

自引率

5.00%

发文量

期刊介绍： IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.