{"title":"熔融石英的中压等离子处理：材料去除率比较研究","authors":"","doi":"10.1007/s11090-023-10440-w","DOIUrl":null,"url":null,"abstract":"<h3>Abstract</h3> <p>The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system.</p>","PeriodicalId":734,"journal":{"name":"Plasma Chemistry and Plasma Processing","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-01-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate\",\"authors\":\"\",\"doi\":\"10.1007/s11090-023-10440-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Abstract</h3> <p>The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system.</p>\",\"PeriodicalId\":734,\"journal\":{\"name\":\"Plasma Chemistry and Plasma Processing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2024-01-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Plasma Chemistry and Plasma Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s11090-023-10440-w\",\"RegionNum\":3,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasma Chemistry and Plasma Processing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s11090-023-10440-w","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate
Abstract
The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system.
期刊介绍：
Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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