社论欢迎新任主编

IF 2.2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Solid-State Circuits Letters Pub Date : 2023-12-13 DOI:10.1109/LSSC.2023.3331812

Tony Chan Carusone;Pui-In Mak

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引用次数: 0

摘要

我作为IEEE固态电路通讯总编辑的三年任期将于2024年1月1日结束，我将离职。这是一个非常有益的经验，监督信件的发展。我们所取得的进展是由IEEE员工和100多位过去和现在的副编辑以及编辑审查委员会成员共同努力的结果。我很高兴地宣布，麦培仁教授将接任下一任总编辑。凭借他广泛的研究专长和领导才能，我相信IEEE固态电路快报将保持其上升轨迹。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Editorial Welcome to the New Editor-in-Chief

My three-year term as the Editor-in-Chief of the IEEE Solid-State Circuits Letters will come to an end on 1 January 2024 and I will step aside. It has been a very rewarding experience to oversee the development of the Letters. The progress we have made has been a collaborative effort, supported by dedicated IEEE staff and over 100 past and present Associate Editors and members of the Editorial Review Board. I am pleased to announce that Prof. Elvis (Pui-In) Mak will take over as the next Editor-in-Chief. With his broad research expertise and leadership qualities, I am confident that the IEEE Solid-State Circuit Letters will maintain its upward trajectory.

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来源期刊

IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering

CiteScore

4.30

自引率

3.70%

发文量

社论 欢迎新任主编

摘要

社论欢迎新任主编