Krzysztof Górecki, Przemysław Ptak, Barbara Dziurdzia
{"title":"焊膏类型对LED模组光学和热参数的影响","authors":"Krzysztof Górecki, Przemysław Ptak, Barbara Dziurdzia","doi":"10.1108/ssmt-07-2021-0043","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.</p><!--/ Abstract__block -->\n<h3>Practical implications</h3>\n<p>The obtained results of investigations can be usable for designers of the assembly process of power LED modules.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"11 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2022-01-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of the soldering paste type on optical and thermal parameters of LED modules\",\"authors\":\"Krzysztof Górecki, Przemysław Ptak, Barbara Dziurdzia\",\"doi\":\"10.1108/ssmt-07-2021-0043\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.</p><!--/ Abstract__block -->\\n<h3>Practical implications</h3>\\n<p>The obtained results of investigations can be usable for designers of the assembly process of power LED modules.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.</p><!--/ Abstract__block -->\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\"11 1\",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2022-01-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-07-2021-0043\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-07-2021-0043","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Influence of the soldering paste type on optical and thermal parameters of LED modules
Purpose
This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.
Design/methodology/approach
The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.
Findings
It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.
Practical implications
The obtained results of investigations can be usable for designers of the assembly process of power LED modules.
Originality/value
This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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