光刻胶TEM样品制备的先进涂层技术

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564259

E. Sebastian, I. Tee, Y. Shen, Kok Wah Lee, L. Tam, Jie Zhu, S. Zhao

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引用次数: 1

摘要

在FIB-TEM样品制备过程中，硬烤光刻胶结构容易变形。本研究显示了样品制备过程中不同的涂覆方法对光刻胶透射电镜下形貌的影响。结果表明，PECVD氧化物是保持光刻胶轮廓变形最小的最佳涂层方法。进一步优化了PECVD参数。

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Advanced coating techniques for photoresist TEM sample preparation

Hard baked photoresist structures tend to deform under FIB-TEM sample preparation. This study shows how different coating methods during sample preparation will affect the photoresist profile under TEM. It turns out that PECVD oxide is the most outstanding coating method to maintain the photoresist profile with minimum deformation. Further PECVD parameter optimization is also demonstrated.

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来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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