散载流子产生-复合的影响主要集中在硅PN结的I-V特性上

V. Obreja, G. Dinoiu, E. Lakatos
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引用次数: 3

摘要

进一步的实验研究了台面硅PN结的漏电流。对于金扩散结,生成-重组中心导致反向和低正向偏置电压下的大块泄漏电流分量占主导地位,但一个较小的表面分量仍然控制着结的阻塞能力。对于电子辐照结,在结温为100-150/spl℃范围内,反向电流的表面分量可能是主要分量。当本体生成-复合中心密度较低时,在室温至200/spl℃以上范围内,它们对反向I-V特性的影响可以忽略不计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of bulk carrier generation-recombination centers upon the I-V characteristic of silicon PN junctions
Further experiments regarding the leakage current of mesa silicon PN junctions are presented. For gold diffused junctions, generation-recombination centers lead to a dominance of the bulk leakage current component both at reverse and low forward bias voltage but a minor surface component still controls the junction blocking capability. For electron irradiated junctions, the surface component of reverse current may be the primary component up to a junction temperature of 100-150/spl deg/C. When the density of bulk generation-recombination centers is low, their influence on the reverse I-V characteristic is negligible from the room temperature up to above 200/spl deg/C.
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