{"title":"散载流子产生-复合的影响主要集中在硅PN结的I-V特性上","authors":"V. Obreja, G. Dinoiu, E. Lakatos","doi":"10.1109/SMICND.1998.732380","DOIUrl":null,"url":null,"abstract":"Further experiments regarding the leakage current of mesa silicon PN junctions are presented. For gold diffused junctions, generation-recombination centers lead to a dominance of the bulk leakage current component both at reverse and low forward bias voltage but a minor surface component still controls the junction blocking capability. For electron irradiated junctions, the surface component of reverse current may be the primary component up to a junction temperature of 100-150/spl deg/C. When the density of bulk generation-recombination centers is low, their influence on the reverse I-V characteristic is negligible from the room temperature up to above 200/spl deg/C.","PeriodicalId":406922,"journal":{"name":"1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)","volume":"81 1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Effect of bulk carrier generation-recombination centers upon the I-V characteristic of silicon PN junctions\",\"authors\":\"V. Obreja, G. Dinoiu, E. Lakatos\",\"doi\":\"10.1109/SMICND.1998.732380\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Further experiments regarding the leakage current of mesa silicon PN junctions are presented. For gold diffused junctions, generation-recombination centers lead to a dominance of the bulk leakage current component both at reverse and low forward bias voltage but a minor surface component still controls the junction blocking capability. For electron irradiated junctions, the surface component of reverse current may be the primary component up to a junction temperature of 100-150/spl deg/C. When the density of bulk generation-recombination centers is low, their influence on the reverse I-V characteristic is negligible from the room temperature up to above 200/spl deg/C.\",\"PeriodicalId\":406922,\"journal\":{\"name\":\"1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)\",\"volume\":\"81 1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-10-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.1998.732380\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1998.732380","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of bulk carrier generation-recombination centers upon the I-V characteristic of silicon PN junctions
Further experiments regarding the leakage current of mesa silicon PN junctions are presented. For gold diffused junctions, generation-recombination centers lead to a dominance of the bulk leakage current component both at reverse and low forward bias voltage but a minor surface component still controls the junction blocking capability. For electron irradiated junctions, the surface component of reverse current may be the primary component up to a junction temperature of 100-150/spl deg/C. When the density of bulk generation-recombination centers is low, their influence on the reverse I-V characteristic is negligible from the room temperature up to above 200/spl deg/C.