{"title":"MEMS/NEMS开关的可靠性与失效分析","authors":"Chengkuo Lee","doi":"10.1109/IPFA.2016.7564328","DOIUrl":null,"url":null,"abstract":"Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Reliability and failure analysis of MEMS/NEMS switches\",\"authors\":\"Chengkuo Lee\",\"doi\":\"10.1109/IPFA.2016.7564328\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564328\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564328","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability and failure analysis of MEMS/NEMS switches
Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.