了解环境对半导体晶圆键合的影响

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947477

Nagito Takehara, T. Naito, K. Tanabe

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引用次数: 0

摘要

为了廉价地制造高性能异质结构半导体器件，我们研究了非洁净室环境下表面处理条件、颗粒密度和键合强度之间的关系。我们系统地检查了清洗晶圆的方案，亲疏水处理和键合条件，并获得了足以用于设备使用的强键。

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Understanding the environmental influence on semiconductor wafer bonding

To manufacture high-performance heterostructured semiconductor devices inexpensively, we investigated the correlation among conditions of surface treatment, particle density, and bonding strength in non-cleanroom environment. We systematically examined schemes of cleaning wafers, hydrophilic / hydrophobic treatments, and conditions of bonding, and obtained strong bonds sufficient in device use.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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