低成本微通道冷却装置的设计、制造与测试

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396671

A. J. Pang, M. Desmulliez, M. Leonard, R. Dhariwal, R. Reuben, A. Holmes, G. Hong, K. Pullen, F. Waldron, O. Slattery, M. Rencz, D. Emerson, R. Barber

{"title":"低成本微通道冷却装置的设计、制造与测试","authors":"A. J. Pang, M. Desmulliez, M. Leonard, R. Dhariwal, R. Reuben, A. Holmes, G. Hong, K. Pullen, F. Waldron, O. Slattery, M. Rencz, D. Emerson, R. Barber","doi":"10.1109/EPTC.2004.1396671","DOIUrl":null,"url":null,"abstract":"The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-lithography, electroforming, replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Design, manufacture and testing of a low-cost micro-channel cooling device\",\"authors\":\"A. J. Pang, M. Desmulliez, M. Leonard, R. Dhariwal, R. Reuben, A. Holmes, G. Hong, K. Pullen, F. Waldron, O. Slattery, M. Rencz, D. Emerson, R. Barber\",\"doi\":\"10.1109/EPTC.2004.1396671\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-lithography, electroforming, replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented\",\"PeriodicalId\":370907,\"journal\":{\"name\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2004.1396671\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396671","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 8

摘要

本文介绍了一种微通道冷却板的建模、仿真、制作和测试。该装置将用于微电子封装冷却应用。镍基微通道冷却板采用借鉴UV-LIGA (uv光刻、电铸、复制)工艺的两层电铸工艺在玻璃基板上制造。空气或液体的强制对流被安排在这个微通道板上。使用特制的设备对冷却板进行了测试，以测量流量压头作为质量流量的函数。介绍了冷却板的水力性能

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Design, manufacture and testing of a low-cost micro-channel cooling device

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-lithography, electroforming, replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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