MDmesh/sup TM/:高压功率mosfet的创新技术

M. Saggio, D. Fagone, S. Musumeci
{"title":"MDmesh/sup TM/:高压功率mosfet的创新技术","authors":"M. Saggio, D. Fagone, S. Musumeci","doi":"10.1109/ISPSD.2000.856774","DOIUrl":null,"url":null,"abstract":"A new PowerMOSFET device, called MDmesh/sup TM/ (Multiple Drain mesh), that joins the best performance in the Power management market either in static and dynamic behavior is presented. A strong reduction in the silicon conduction losses per area allowed a valuable resize of the device area and a reduction of the used package volume. Moreover, a valuable reduction in device internal capacitance and gate charge has been observed and an optimized switching behavior has been obtained. A deep look inside the device performances will be presented and the main device features will be compared with the ones of a device having the same conduction losses fabricated with a standard technology.","PeriodicalId":260241,"journal":{"name":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"62","resultStr":"{\"title\":\"MDmesh/sup TM/: innovative technology for high voltage Power MOSFETs\",\"authors\":\"M. Saggio, D. Fagone, S. Musumeci\",\"doi\":\"10.1109/ISPSD.2000.856774\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new PowerMOSFET device, called MDmesh/sup TM/ (Multiple Drain mesh), that joins the best performance in the Power management market either in static and dynamic behavior is presented. A strong reduction in the silicon conduction losses per area allowed a valuable resize of the device area and a reduction of the used package volume. Moreover, a valuable reduction in device internal capacitance and gate charge has been observed and an optimized switching behavior has been obtained. A deep look inside the device performances will be presented and the main device features will be compared with the ones of a device having the same conduction losses fabricated with a standard technology.\",\"PeriodicalId\":260241,\"journal\":{\"name\":\"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"62\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2000.856774\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2000.856774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 62

摘要

提出了一种新的PowerMOSFET器件,称为MDmesh/sup TM/ (Multiple Drain mesh),它在静态和动态行为方面都是电源管理市场上性能最好的器件。每面积硅导通损耗的显著降低使得器件面积的尺寸调整和所用封装体积的减小成为可能。此外,还观察到器件内部电容和栅极电荷的有价值的降低,并获得了优化的开关行为。我们将深入研究该器件的性能,并将其主要特性与采用标准技术制造的具有相同传导损耗的器件进行比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MDmesh/sup TM/: innovative technology for high voltage Power MOSFETs
A new PowerMOSFET device, called MDmesh/sup TM/ (Multiple Drain mesh), that joins the best performance in the Power management market either in static and dynamic behavior is presented. A strong reduction in the silicon conduction losses per area allowed a valuable resize of the device area and a reduction of the used package volume. Moreover, a valuable reduction in device internal capacitance and gate charge has been observed and an optimized switching behavior has been obtained. A deep look inside the device performances will be presented and the main device features will be compared with the ones of a device having the same conduction losses fabricated with a standard technology.
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