Reliability aspects of 3D integrated power devices

The need for higher switching frequencies, higher operation temperatures and lower volume of power devices increases remarkably due to the increased demand of products with higher power densities, lower weight and smoother power output [1], [2]. Especially, wide band gap materials are needed to fulfill all requirements, but cannot reach their full potential with state of the art planar package technology [1]. To obtain reduced parasitics within the power loop, to reduce the devices footprint, improve heat removal and ensure package reliability, a three dimensional integration of power devices can be utilized [3], [4], [5], [6], [7]. The potential of 3D integration is enormous and essential in order to push power electronic devices to their theoretical limit. Recent developments could not only obtain improved switching proficiencies [8], in addition, remarkable exceedance of active power cycling lifetime and an increased capability to withstand critical overload conditions could be realized [2]. Finally, the establishment of advanced package technologies relies on several reliability and robustness tests. New power module designs are evaluated.