Ankit Pokhrel, Anshul Gupta, Minsoo Kim, J. Soulie, Sujan K. Sarkar, Y. Canvel, Vincent Renaud, B. Kenens, Blake Hodges, Trent Josephsen, Sabine O’Neal, Q. Herr, A. Herr, Z. Tokei
{"title":"为超导数字逻辑实现双金属级半damascene互连:超导NbxTi(1-x)N的制备、表征和电学测量","authors":"Ankit Pokhrel, Anshul Gupta, Minsoo Kim, J. Soulie, Sujan K. Sarkar, Y. Canvel, Vincent Renaud, B. Kenens, Blake Hodges, Trent Josephsen, Sabine O’Neal, Q. Herr, A. Herr, Z. Tokei","doi":"10.1109/IITC/MAM57687.2023.10154725","DOIUrl":null,"url":null,"abstract":"NbxTi(1-x)N is a promising alternative to replace conventional Nb in superconducting devices. In this work, short loop devices with metal lines and vias were fabricated in IMEC 300-mm pilot line using direct metal etch, semi-damascene approach. Single line resistance of NbxTi(1-x)N wires show that >95% of devices meet the expected resistance of <5000 Ω/μm and leakage measurements show that >95% of devices have low leakage of <1E–16 A/ μm. Low temperature measurements show that the NbxTi(1-x)N wires have transition temperature of 12.5K within 0.5K that of thin film and a critical current of 0.15 mA, within 2X of theoretical maximum.","PeriodicalId":241835,"journal":{"name":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N\",\"authors\":\"Ankit Pokhrel, Anshul Gupta, Minsoo Kim, J. Soulie, Sujan K. Sarkar, Y. Canvel, Vincent Renaud, B. Kenens, Blake Hodges, Trent Josephsen, Sabine O’Neal, Q. Herr, A. Herr, Z. Tokei\",\"doi\":\"10.1109/IITC/MAM57687.2023.10154725\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"NbxTi(1-x)N is a promising alternative to replace conventional Nb in superconducting devices. In this work, short loop devices with metal lines and vias were fabricated in IMEC 300-mm pilot line using direct metal etch, semi-damascene approach. Single line resistance of NbxTi(1-x)N wires show that >95% of devices meet the expected resistance of <5000 Ω/μm and leakage measurements show that >95% of devices have low leakage of <1E–16 A/ μm. Low temperature measurements show that the NbxTi(1-x)N wires have transition temperature of 12.5K within 0.5K that of thin film and a critical current of 0.15 mA, within 2X of theoretical maximum.\",\"PeriodicalId\":241835,\"journal\":{\"name\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC/MAM57687.2023.10154725\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC/MAM57687.2023.10154725","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
NbxTi(1-x)N is a promising alternative to replace conventional Nb in superconducting devices. In this work, short loop devices with metal lines and vias were fabricated in IMEC 300-mm pilot line using direct metal etch, semi-damascene approach. Single line resistance of NbxTi(1-x)N wires show that >95% of devices meet the expected resistance of <5000 Ω/μm and leakage measurements show that >95% of devices have low leakage of <1E–16 A/ μm. Low temperature measurements show that the NbxTi(1-x)N wires have transition temperature of 12.5K within 0.5K that of thin film and a critical current of 0.15 mA, within 2X of theoretical maximum.