J. Otterstedt, M. Kuboschek, J. Castagne, J. Mucha
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引用次数: 5
摘要
本文介绍了一种名为MAXPE9的大面积集成电路,它在16.6 cm/sup /的面积上集成了9个可编程视频信号处理元件(pe)。每个PE的峰值算术性能为每秒1千兆次操作(GOPS)。由于良率的考虑,冗余概念已经实现,即使在存在生产缺陷的情况下,也会导致工作芯片使用更少的pe。每个PE都内置了自检(BIST)功能,允许在其集成的容错BIST控制器的控制下对自身进行独立测试。有缺陷的pe被关闭。只有通过BIST的pe才会被用于视频处理任务。此外,全局输入和输出总线可以使用激光熔断器和激光链路阵列重新配置,从而避免了对整个芯片致命的缺陷。原型已在0.8 /spl μ m CMOS工艺中制造,该工艺采用重叠曝光的晶圆步进掩模结构。采用冗余,在这些原型上,每个芯片多达6个pe在66 MHz下工作,从而为视频编码任务(如H.261, MPEG-1和MPEG-2)提供高达6 GOPS的峰值算法性能。
A 16.6 cm/sup 2/ large area integrated circuit consisting of 9 video signal processors
In this paper we introduce a large area integrated circuit (LAIC) called MAXPE9 which integrates 9 programmable video signal processing elements (PEs) on an area of 16.6 cm/sup 2/. Each PE has a peak arithmetic performance of 1 giga operations per second (GOPS). Due to yield considerations redundancy concepts have been implemented that even in the presence of production defects result in working chips utilizing a lower number of PEs. Each PE has built in self-test (BIST) capabilities which allow for an independent test of itself under the control of its integrated fault-tolerant BIST controller. Defective PEs are switched off. Only the PEs passing the BIST are used for video processing tasks. Furthermore, the global input and output buses can be reconfigured using arrays of laser fuses and laser links, thus circumventing defects which are otherwise lethal for the complete chip. Prototypes have been fabricated in a 0.8 /spl mu/m CMOS process structured by masks using wafer stepping with overlapping exposures. Employing the redundancy, on these prototypes up to 6 PEs per chip were functional at 66 MHz, thus providing a peak arithmetic performance of up to 6 GOPS per chip for video coding tasks (like H.261, MPEG-1 and MPEG-2).