TMR磁头在ESD瞬态中的击穿行为

Zhao-Yu Teng, M. Mo, W. Li, Min-Bing Wong, S. Chou
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引用次数: 3

摘要

在不同电阻的最新TMR磁头上进行HBM和D-CDM击穿试验。基于TMR磁头在HBM和D-CDM下的实际失效电压,对单个TMR磁头进行了Pspice模拟,试图研究通过TMR势垒的损伤电流,以及穿过TMR势垒的电压。结果表明,在短瞬态测试- hbm和DCDM中,损伤电流阈值(通过TMR势垒)与TMR电阻成反比,而损伤电流密度阈值sigmah在各暂态模型中均为常数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Breakdown behavior of TMR head in ESD transients
HBM and D-CDM breakdown testing were preformed on the latest TMR heads of different resistance. Pspice simulations were conducted for individual TMR heads based on their actual failure voltage at HBM and D-CDM, in an attempt to investigate damage current through TMR barrier, as well as voltage across TMR barrier. Results show that in short transient test-HBM and DCDM, damage current threshold (through TMR barrier) is inversely proportional to TMR resistance, while damaging current density threshold sigmah is a constant in each transient model.
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