移动电子的封装趋势-迈向晶圆级封装

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746764

X. Baraton

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引用次数: 0

摘要

移动电子产品的增长最近得到了高端设备集成更多功能的支持。智能手机的增长速度确实比整个手机市场快得多。因此，对包装的要求要求突破性的创新，以优化的成本实现最佳的包装集成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Packaging trends in mobile electronics - Towards wafer level packaging

Mobile electronics growth has recently been supported by the integration of more features for higher end devices. Smart phones are indeed growing at much faster pace than the overall mobile phone market. Requirements towards packaging are therefore asking breakthrough innovation to allow best package integration at optimized cost.

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来源期刊

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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