{"title":"超薄SOI和超薄栅氧化mosfet的性能和可靠性问题","authors":"A. Toriumi, J. Koga, H. Satake, A. Ohata","doi":"10.1109/IEDM.1995.499349","DOIUrl":null,"url":null,"abstract":"Inversion layer mobility in thin SOI MOSFETs has been investigated from the viewpoint of the SOI thickness effects on device performance. Next, thin oxide properties such as Qbd, Vgt, Dit, and SILC have been studied as a function of oxide thickness. It is demonstrated that there is a small window for high reliability in ultra-thin SiO/sup 2/ regime.","PeriodicalId":137564,"journal":{"name":"Proceedings of International Electron Devices Meeting","volume":"161 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"Performance and reliability concerns of ultra-thin SOI and ultra-thin gate oxide MOSFETs\",\"authors\":\"A. Toriumi, J. Koga, H. Satake, A. Ohata\",\"doi\":\"10.1109/IEDM.1995.499349\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Inversion layer mobility in thin SOI MOSFETs has been investigated from the viewpoint of the SOI thickness effects on device performance. Next, thin oxide properties such as Qbd, Vgt, Dit, and SILC have been studied as a function of oxide thickness. It is demonstrated that there is a small window for high reliability in ultra-thin SiO/sup 2/ regime.\",\"PeriodicalId\":137564,\"journal\":{\"name\":\"Proceedings of International Electron Devices Meeting\",\"volume\":\"161 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-12-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.1995.499349\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1995.499349","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance and reliability concerns of ultra-thin SOI and ultra-thin gate oxide MOSFETs
Inversion layer mobility in thin SOI MOSFETs has been investigated from the viewpoint of the SOI thickness effects on device performance. Next, thin oxide properties such as Qbd, Vgt, Dit, and SILC have been studied as a function of oxide thickness. It is demonstrated that there is a small window for high reliability in ultra-thin SiO/sup 2/ regime.