3D集成的工艺开发:用于高密度芯片间互连的导电晶圆键合

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886143

Chongshen Song, Wenqi Zhang, D. Shangguan

{"title":"3D集成的工艺开发:用于高密度芯片间互连的导电晶圆键合","authors":"Chongshen Song, Wenqi Zhang, D. Shangguan","doi":"10.1109/LTB-3D.2014.6886143","DOIUrl":null,"url":null,"abstract":"This paper discusses the application of conductive wafer bonding, especially wafer level hybrid Cu-Cu bonding, for realizing high density inter-chip interconnection. 3D integration process using conductive wafer bonding and the test vehicle for bonding process evaluation are described. Different pre-bonding surface treatment methods and bonding procedures are studied and compared for yield and throughput optimization.","PeriodicalId":123514,"journal":{"name":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection\",\"authors\":\"Chongshen Song, Wenqi Zhang, D. Shangguan\",\"doi\":\"10.1109/LTB-3D.2014.6886143\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the application of conductive wafer bonding, especially wafer level hybrid Cu-Cu bonding, for realizing high density inter-chip interconnection. 3D integration process using conductive wafer bonding and the test vehicle for bonding process evaluation are described. Different pre-bonding surface treatment methods and bonding procedures are studied and compared for yield and throughput optimization.\",\"PeriodicalId\":123514,\"journal\":{\"name\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-07-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D.2014.6886143\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D.2014.6886143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文讨论了导电晶圆键合，特别是晶圆级混合Cu-Cu键合在实现高密度芯片间互连中的应用。介绍了利用导电晶圆键合的三维集成工艺和用于键合工艺评价的测试车。研究并比较了不同的预粘接表面处理方法和粘接工艺，以优化收率和吞吐量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Process development for 3D integration: Conductive wafer bonding for high density inter-chip interconnection

This paper discusses the application of conductive wafer bonding, especially wafer level hybrid Cu-Cu bonding, for realizing high density inter-chip interconnection. 3D integration process using conductive wafer bonding and the test vehicle for bonding process evaluation are described. Different pre-bonding surface treatment methods and bonding procedures are studied and compared for yield and throughput optimization.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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