{"title":"一种测量电容器温度瞬变的方法","authors":"Z. Sárkány, M. Rencz","doi":"10.1109/EPTC.2016.7861594","DOIUrl":null,"url":null,"abstract":"The thermal management is important not only for semiconductor components, but for discrete capacitors as well. In this paper a new measurement setup is presented that adopts the thermal transient measurement technique for capacitor components. The measurement method is demonstrated on a through-hole ceramic capacitor and validated using CFD simulations. It is also shown that using the structure function the simulation model parameters can be fine-tuned to provide a transient response that is matching the measured data.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A way for measuring the temperature transients of capacitors\",\"authors\":\"Z. Sárkány, M. Rencz\",\"doi\":\"10.1109/EPTC.2016.7861594\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The thermal management is important not only for semiconductor components, but for discrete capacitors as well. In this paper a new measurement setup is presented that adopts the thermal transient measurement technique for capacitor components. The measurement method is demonstrated on a through-hole ceramic capacitor and validated using CFD simulations. It is also shown that using the structure function the simulation model parameters can be fine-tuned to provide a transient response that is matching the measured data.\",\"PeriodicalId\":136525,\"journal\":{\"name\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2016.7861594\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861594","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A way for measuring the temperature transients of capacitors
The thermal management is important not only for semiconductor components, but for discrete capacitors as well. In this paper a new measurement setup is presented that adopts the thermal transient measurement technique for capacitor components. The measurement method is demonstrated on a through-hole ceramic capacitor and validated using CFD simulations. It is also shown that using the structure function the simulation model parameters can be fine-tuned to provide a transient response that is matching the measured data.
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