基于反建模的深亚微米mosfet沟道掺杂物分布和Leff提取

K. Kai, H. Hayashi, S. Kuroda, K. Fukuda, K. Nishi
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引用次数: 0

摘要

对于深亚微米mosfet的工艺建模,掺杂物分布信息对保证仿真精度非常重要。本文报道了一种从测量的I-V特性中提取实际器件沟道掺杂物分布和有效沟道长度(Leff)的新方法,并通过仿真验证了该方法的准确性。与C-V法测量的电容值相比,即使在传统的窄宽度mosfet中测量的电流值也是准确的。这种方法不需要特殊的装置。还需要注意的是,只需要一个被测量的器件就可以提取其通道掺杂物轮廓和Leff,这与通过一系列不同通道长度的mosfet提取Leff的其他方法相比。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Channel dopant profile and Leff extraction of deep submicron MOSFETs by inverse modeling
For process modeling of deep submicron MOSFETs, information on dopant profile is very important to ensure a simulation accuracy. In this paper, we report a new method to extract channel dopant profile and an effective channel length (Leff) of actual device from measured I-V characteristics, and the accuracy of this method confirmed by simulation. In comparison to the capacitance values measured in C-V method, measured current values are accurate even in conventional narrow width MOSFETs. No special devices are necessary in this method. Also noted is that only one device to be measured is necessary to extract its channel dopant profile and Leff, which contrasts other methods to extract Leff by a series of MOSFETs with different channel lengths.
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