{"title":"考虑损伤演化的PBGA焊点热疲劳分析","authors":"S. Lee, K. Newman, Livia Hu","doi":"10.1115/imece2000-2265","DOIUrl":null,"url":null,"abstract":"\n This paper presents a computational thermal fatigue analysis for the life prediction of solder joints in a plastic ball grid array-printed circuit board (PBGA-PCB) assembly. The PBGA has a full grid array of 256 solder balls with 1.0 mm ball pitch. The PCB is a 4-layer FR-4 laminate with a thickness of 1.57 mm (62 mils). The assembly is subjected to −40∼125°C thermal cycling (one-hour cycle). Finite element analysis is performed to obtain the creep hysteresis loops. Based on a previously developed model, the evolution of damage is considered in the life prediction of solder joints. Besides, PCBs with various thicknesses (40 mils and 20 mils) are investigated. The results from different cases are compared and discussed.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Thermal Fatigue Analysis of PBGA Solder Joints With the Consideration of Damage Evolution\",\"authors\":\"S. Lee, K. Newman, Livia Hu\",\"doi\":\"10.1115/imece2000-2265\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This paper presents a computational thermal fatigue analysis for the life prediction of solder joints in a plastic ball grid array-printed circuit board (PBGA-PCB) assembly. The PBGA has a full grid array of 256 solder balls with 1.0 mm ball pitch. The PCB is a 4-layer FR-4 laminate with a thickness of 1.57 mm (62 mils). The assembly is subjected to −40∼125°C thermal cycling (one-hour cycle). Finite element analysis is performed to obtain the creep hysteresis loops. Based on a previously developed model, the evolution of damage is considered in the life prediction of solder joints. Besides, PCBs with various thicknesses (40 mils and 20 mils) are investigated. The results from different cases are compared and discussed.\",\"PeriodicalId\":179094,\"journal\":{\"name\":\"Packaging of Electronic and Photonic Devices\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-11-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Packaging of Electronic and Photonic Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece2000-2265\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Packaging of Electronic and Photonic Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece2000-2265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
本文提出了一种用于预测塑料球栅阵列印刷电路板(PBGA-PCB)组件焊点寿命的计算热疲劳分析方法。PBGA具有256个1.0毫米球间距的焊接球的全网格阵列。该PCB为4层FR-4层压板，厚度为1.57 mm (62 mils)。该组件经受−40 ~ 125°C热循环(一小时循环)。通过有限元分析得到蠕变迟滞回线。基于先前建立的模型，在焊点寿命预测中考虑了损伤的演化。此外，还研究了不同厚度的pcb (40mil和20mil)。对不同案例的结果进行了比较和讨论。
Thermal Fatigue Analysis of PBGA Solder Joints With the Consideration of Damage Evolution
This paper presents a computational thermal fatigue analysis for the life prediction of solder joints in a plastic ball grid array-printed circuit board (PBGA-PCB) assembly. The PBGA has a full grid array of 256 solder balls with 1.0 mm ball pitch. The PCB is a 4-layer FR-4 laminate with a thickness of 1.57 mm (62 mils). The assembly is subjected to −40∼125°C thermal cycling (one-hour cycle). Finite element analysis is performed to obtain the creep hysteresis loops. Based on a previously developed model, the evolution of damage is considered in the life prediction of solder joints. Besides, PCBs with various thicknesses (40 mils and 20 mils) are investigated. The results from different cases are compared and discussed.
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