HBT技术与建模

D. Hitko, J. Li
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引用次数: 2

摘要

InP HBT技术已经达到了成熟的水平,在高速、低抖动和高动态范围作为鉴别器的情况下,带有1000个晶体管的混合信号ic已经变得相当常规,这就需要模拟器效率高的紧凑模型表示,涵盖了一系列器件尺寸和所有工作模式。与更传统的基于分级的SiGe双极器件相比,InP hbt具有许多特征,使其从建模角度来看是独一无二的。介绍了InP HBT器件特性的概述,以及为支持基于VBIC的高速混合信号电路设计的可扩展紧凑模型的开发而实施的综合器件特性和建模策略的重点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
InP HBT technology and modeling
InP HBT technologies have reached a level of maturity where mixed-signal ICs with 1000s of transistors have become fairly routine in a regime where high speed, low jitter, and high dynamic range are discriminators, necessitating simulator-efficient compact model representations covering a range of device sizes and all operating modes. In comparison to the more traditional graded-base SiGe bipolar devices, InP HBTs have a number of traits that make them unique from a modeling perspective. An overview of InP HBT device characteristics is presented, along with highlights of a comprehensive device characterization and modeling strategy implemented to support the development of a scalable compact model based on VBIC for the design of high-speed mixed-signal circuits.
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