基于MEMS的器件接口板

2010 IEEE International Test Conference Pub Date : 2010-11-01 DOI:10.1109/TEST.2010.5699296

Nabeeh Kandalaft, I. Basith, R. Rashidzadeh

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引用次数: 7

摘要

在千兆赫频率范围内，器件接口板的性能下降增加了良率损失和制造成本。在这张海报中，提出了一种基于MEMS的解决方案来设计器件接口板(DIB)，支持被测器件与测试仪之间的高速连接。仿真结果表明，该方案可在50ghz频率下工作，且信号完整性无损。

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A MEMS based device interface board

At gigahertz frequency range, performance degradation of the device interface board increases the yield loss and the cost of manufacturing. In this poster a MEMS based solution is proposed to design a Device Interface Board (DIB) supporting high-speed connectivity between the device under test and the tester. Simulation results indicate that the proposed scheme can operate up to 50 GHz without considerable signal integrity degradation.

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2010 IEEE International Test Conference

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