采用小于3 μmφ鲁棒凹凸结的三维堆叠像素探测器和传感器技术

2016 IEEE International 3D Systems Integration Conference (3DIC) Pub Date : 2016-11-01 DOI:10.1109/3DIC.2016.7970029

M. Motoyoshi, K. Yanagimura, T. Fushimi, Junichi Takanohashi, M. Murugesan, M. Aoyagi, M. Koyanagi

{"title":"采用小于3 μmφ鲁棒凹凸结的三维堆叠像素探测器和传感器技术","authors":"M. Motoyoshi, K. Yanagimura, T. Fushimi, Junichi Takanohashi, M. Murugesan, M. Aoyagi, M. Koyanagi","doi":"10.1109/3DIC.2016.7970029","DOIUrl":null,"url":null,"abstract":"This paper presents experimental results for a prototype pixel detector with 3.0-μmφ gold cone bumps fabricated by NpD (nanoparticle deposition) and Stacked CdTe/Si X-ray sensor TEG with gold cylindrical bumps fabricated by a low-incident-angle deposition method. The both bump resistances are less than 0.5ohm.","PeriodicalId":166245,"journal":{"name":"2016 IEEE International 3D Systems Integration Conference (3DIC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions\",\"authors\":\"M. Motoyoshi, K. Yanagimura, T. Fushimi, Junichi Takanohashi, M. Murugesan, M. Aoyagi, M. Koyanagi\",\"doi\":\"10.1109/3DIC.2016.7970029\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents experimental results for a prototype pixel detector with 3.0-μmφ gold cone bumps fabricated by NpD (nanoparticle deposition) and Stacked CdTe/Si X-ray sensor TEG with gold cylindrical bumps fabricated by a low-incident-angle deposition method. The both bump resistances are less than 0.5ohm.\",\"PeriodicalId\":166245,\"journal\":{\"name\":\"2016 IEEE International 3D Systems Integration Conference (3DIC)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC.2016.7970029\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC.2016.7970029","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文介绍了采用纳米粒子沉积法制备3.0 μmφ金锥突的像素探测器原型和采用低入射角沉积法制备金圆柱突的堆叠式CdTe/Si x射线传感器TEG的实验结果。两种碰撞电阻均小于0.5欧姆。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions

This paper presents experimental results for a prototype pixel detector with 3.0-μmφ gold cone bumps fabricated by NpD (nanoparticle deposition) and Stacked CdTe/Si X-ray sensor TEG with gold cylindrical bumps fabricated by a low-incident-angle deposition method. The both bump resistances are less than 0.5ohm.

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2016 IEEE International 3D Systems Integration Conference (3DIC)

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