结合电流成像、EBIC/EBAC和电气探测，实现快速可靠的电气故障原位隔离

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564288

S. Kleindiek, K. Schock, A. Rummel, Michael Zschomack, P. Limbecker, Andreas Meyer, M. Kemmler

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引用次数: 5

摘要

使用紧凑的纳米探针装置，包括八个探针尖端连接到压电驱动的微操纵器，在扫描电镜内对28纳米样品进行各种故障隔离技术。最近实现的电流成像技术用于快速成像大型触点阵列，提供了一种定位故障的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Combining current imaging, EBIC/EBAC, and electrical probing for fast and reliable in situ electrical fault isolation

Using a compact nanoprobing setup comprising eight probe tips attached to piezo-driven micromanipulators, various techniques for fault isolation are performed on 28 nm samples inside an SEM. The recently implemented Current Imaging technique is used to quickly image large arrays of contacts providing a means of locating faults.

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来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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