通过晶圆到晶圆转移技术实现异质集成

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886172

Shuji Tanaka

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引用次数: 4

摘要

提出了一种用于不同尺寸芯片之间集成封装的激光辅助选择性芯片转移技术，并将其应用于2 GHz芯片尺寸封装薄膜体声波振荡器。研究了基于激光辅助剥离和金属键合的薄膜转移技术，并将其应用于电视白色空间认知无线局域网的单片带宽可调谐表面声波(SAW)滤波器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Heterogeneous integration by wafer-to-wafer transfer technology

Laser-assisted selective die transfer for wafer-level integration and packaging between different sizes of dies was developed, and applied to a 2 GHz chip-size-packaged film bulk acoustic wave oscillator. Wafer-to-wafer thin film transfer by laser-assisted peeling and metal-metal bonding was developed and applied to a monolithic bandwidth tunable surface acoustic wave (SAW) filter for TV white space cognitive wireless LAN.

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来源期刊

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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