通过全面的可靠性验证,确保稳健的ESD设计

K. Henderson, Brian Hulse, M. Styduhar, Peter Michelson
{"title":"通过全面的可靠性验证,确保稳健的ESD设计","authors":"K. Henderson, Brian Hulse, M. Styduhar, Peter Michelson","doi":"10.1109/IIRW56459.2022.10032761","DOIUrl":null,"url":null,"abstract":"Weaknesses in electrostatic discharge (ESD) connection paths directly contribute to field failures if they are not properly identified and fixed pre-silicon. Although traditional verification tools such as design rule checking (DRC), layout vs. schematic (LVS) verification and electrical rule checking (ERC) are still required in an integrated circuit (IC) verification flow, they can no longer be the only tools used. This work demonstrates the importance of adding comprehensive reliability checking to the overall IC verification flow to accurately identify reliability issues that cannot be found using traditional verification methods.","PeriodicalId":446436,"journal":{"name":"2022 IEEE International Integrated Reliability Workshop (IIRW)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Ensuring robust ESD design with comprehensive reliability verification\",\"authors\":\"K. Henderson, Brian Hulse, M. Styduhar, Peter Michelson\",\"doi\":\"10.1109/IIRW56459.2022.10032761\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Weaknesses in electrostatic discharge (ESD) connection paths directly contribute to field failures if they are not properly identified and fixed pre-silicon. Although traditional verification tools such as design rule checking (DRC), layout vs. schematic (LVS) verification and electrical rule checking (ERC) are still required in an integrated circuit (IC) verification flow, they can no longer be the only tools used. This work demonstrates the importance of adding comprehensive reliability checking to the overall IC verification flow to accurately identify reliability issues that cannot be found using traditional verification methods.\",\"PeriodicalId\":446436,\"journal\":{\"name\":\"2022 IEEE International Integrated Reliability Workshop (IIRW)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Integrated Reliability Workshop (IIRW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW56459.2022.10032761\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Integrated Reliability Workshop (IIRW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW56459.2022.10032761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

静电放电(ESD)连接路径的弱点,如果没有正确识别和固定预硅,将直接导致现场故障。虽然传统的验证工具,如设计规则检查(DRC),布局与原理图(LVS)验证和电气规则检查(ERC)在集成电路(IC)验证流程中仍然需要,但它们不再是唯一使用的工具。这项工作证明了在整个IC验证流程中添加全面可靠性检查的重要性,以准确识别使用传统验证方法无法发现的可靠性问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ensuring robust ESD design with comprehensive reliability verification
Weaknesses in electrostatic discharge (ESD) connection paths directly contribute to field failures if they are not properly identified and fixed pre-silicon. Although traditional verification tools such as design rule checking (DRC), layout vs. schematic (LVS) verification and electrical rule checking (ERC) are still required in an integrated circuit (IC) verification flow, they can no longer be the only tools used. This work demonstrates the importance of adding comprehensive reliability checking to the overall IC verification flow to accurately identify reliability issues that cannot be found using traditional verification methods.
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