高取向纳米孪晶Cu薄膜上薄金盖低温Cu- Cu直接键合

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 1900-01-01 DOI:10.23919/LTB-3D.2019.8735271

Fu-Chian Chen, Yu-Ting Wu, Chih Chen

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引用次数: 0

摘要

在这项研究中，我们在高(111)取向的纳米双铜膜表面覆盖了金。利用(111)铜的高扩散率和金的低活度，可以实现较低的键合温度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly -orientated Nanotwinned Cu Films

In this study, we capped gold on the surface of highly (111)- orientated nano-twin copper films. With the great diffusivity of (111) copper and the low activity in gold, we can achieve a lower bonding temperature.

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来源期刊

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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