采用模板剥离法对镀金薄膜进行表面平滑，以实现三维集成的低温键合

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598356

L. Thu, T. Matsumae, Y. Kurashima, H. Takagi, E. Higurashi

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引用次数: 1

摘要

本文报道了基于模板剥离法的多层薄膜转移工艺对化学镀金粗糙表面的平滑处理。制备出了表面粗糙度小于1.0 nm的超光滑Au，获得了适合Au/Au低温键合的表面。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration

This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.

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来源期刊

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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