H. Toyoda, T. Kawanoue, M. Hasunuma, H. Kaneko, M. Miyauchi
{"title":"在非晶钽铝衬底上形成超织构铝提高电迁移寿命","authors":"H. Toyoda, T. Kawanoue, M. Hasunuma, H. Kaneko, M. Miyauchi","doi":"10.1109/RELPHY.1994.307839","DOIUrl":null,"url":null,"abstract":"A new fabrication technique for hyper-textured aluminum (Al) films has been developed by using an amorphous tantalum-aluminum (Ta-Al) underlayer. The full width at half maximum (FWHM) value of the (111) rocking curve for Al film has been attained to be less than 1 degree. It has been clarified that the empirical relation between the electromigration (EM) lifetime of an Al interconnection /spl tau/ and the FWHM value /spl omega/ is described as /spl tausup /spl prop/spl omegasup -2/. This result has confirmed that a hyper-texture is a promising approach to withstand higher current densities required in future ULSIs.<<ETX>>","PeriodicalId":276224,"journal":{"name":"Proceedings of 1994 IEEE International Reliability Physics Symposium","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Improvement in the electromigration lifetime using hyper-textured aluminum formed on amorphous tantalum-aluminum underlayer\",\"authors\":\"H. Toyoda, T. Kawanoue, M. Hasunuma, H. Kaneko, M. Miyauchi\",\"doi\":\"10.1109/RELPHY.1994.307839\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new fabrication technique for hyper-textured aluminum (Al) films has been developed by using an amorphous tantalum-aluminum (Ta-Al) underlayer. The full width at half maximum (FWHM) value of the (111) rocking curve for Al film has been attained to be less than 1 degree. It has been clarified that the empirical relation between the electromigration (EM) lifetime of an Al interconnection /spl tau/ and the FWHM value /spl omega/ is described as /spl tausup /spl prop/spl omegasup -2/. This result has confirmed that a hyper-texture is a promising approach to withstand higher current densities required in future ULSIs.<<ETX>>\",\"PeriodicalId\":276224,\"journal\":{\"name\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1994.307839\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1994.307839","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improvement in the electromigration lifetime using hyper-textured aluminum formed on amorphous tantalum-aluminum underlayer
A new fabrication technique for hyper-textured aluminum (Al) films has been developed by using an amorphous tantalum-aluminum (Ta-Al) underlayer. The full width at half maximum (FWHM) value of the (111) rocking curve for Al film has been attained to be less than 1 degree. It has been clarified that the empirical relation between the electromigration (EM) lifetime of an Al interconnection /spl tau/ and the FWHM value /spl omega/ is described as /spl tausup /spl prop/spl omegasup -2/. This result has confirmed that a hyper-texture is a promising approach to withstand higher current densities required in future ULSIs.<>