{"title":"汽车音频放大器的生成式散热器设计","authors":"R. Bornoff, Brad Subat, John Wilson","doi":"10.1109/SEMI-THERM.2018.8357379","DOIUrl":null,"url":null,"abstract":"A classical heatsink design approach entails an assumption of the heatsink area extending fin topology followed by a parametric optimisation to maximize thermal performance and potentially minimise mass. This paper presents an alternative approach whereby the fin topology is identified as part of the optimisation process. This involves a generative heatsink growth stage so as to minimise the overall heatsink thermal resistance followed by a heatsink mass reduction stage that seeks to remove mass without unduly affecting thermal performance. Application to an automotive audio amplifier is presented, resulting in an 18% reduction in heatsink mass with no detriment to thermal performance compared to an existing angled plate fin type topology.","PeriodicalId":277758,"journal":{"name":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Generative heatsink design for an automotive audio amplifier\",\"authors\":\"R. Bornoff, Brad Subat, John Wilson\",\"doi\":\"10.1109/SEMI-THERM.2018.8357379\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A classical heatsink design approach entails an assumption of the heatsink area extending fin topology followed by a parametric optimisation to maximize thermal performance and potentially minimise mass. This paper presents an alternative approach whereby the fin topology is identified as part of the optimisation process. This involves a generative heatsink growth stage so as to minimise the overall heatsink thermal resistance followed by a heatsink mass reduction stage that seeks to remove mass without unduly affecting thermal performance. Application to an automotive audio amplifier is presented, resulting in an 18% reduction in heatsink mass with no detriment to thermal performance compared to an existing angled plate fin type topology.\",\"PeriodicalId\":277758,\"journal\":{\"name\":\"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SEMI-THERM.2018.8357379\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SEMI-THERM.2018.8357379","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Generative heatsink design for an automotive audio amplifier
A classical heatsink design approach entails an assumption of the heatsink area extending fin topology followed by a parametric optimisation to maximize thermal performance and potentially minimise mass. This paper presents an alternative approach whereby the fin topology is identified as part of the optimisation process. This involves a generative heatsink growth stage so as to minimise the overall heatsink thermal resistance followed by a heatsink mass reduction stage that seeks to remove mass without unduly affecting thermal performance. Application to an automotive audio amplifier is presented, resulting in an 18% reduction in heatsink mass with no detriment to thermal performance compared to an existing angled plate fin type topology.