铜线键合的未来:实验与数值相结合的方法来提高铜线键合的质量

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464572

E. Spaan, E. Ooms, W. V. van Driel, C. Yuan, D.G. Yang, G.Q. Zhang

{"title":"铜线键合的未来:实验与数值相结合的方法来提高铜线键合的质量","authors":"E. Spaan, E. Ooms, W. V. van Driel, C. Yuan, D.G. Yang, G.Q. Zhang","doi":"10.1109/ESIME.2010.5464572","DOIUrl":null,"url":null,"abstract":"In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality\",\"authors\":\"E. Spaan, E. Ooms, W. V. van Driel, C. Yuan, D.G. Yang, G.Q. Zhang\",\"doi\":\"10.1109/ESIME.2010.5464572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464572\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 14

摘要

本文对铜线连接技术进行了研究。从数值的角度，模拟了线接过程。在专门设计的键垫上进行了实验，以验证模型的正确性。因此，这导致一个彻底的理解线连接过程，特别是在这个过程中发挥作用的力量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量