回收FPGA检测的老化分析

H. Dogan, Domenic Forte, M. Tehranipoor
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引用次数: 67

摘要

假冒电子元件行业通过将回收的元件渗透到供应链中,继续威胁着系统的安全性和可靠性。随着fpga在关键系统中的使用越来越多,回收fpga引起了政府和工业的重大关注。在本文中,我们提出了一种两相检测方法来区分回收(使用)fpga和新fpga。这两种方法都依赖于通过支持向量机(SVM)进行分类的机器学习。第一阶段“按原样”检查可疑的fpga,而第二阶段需要一些加速老化。更具体地说,第一阶段通过将分布在fpga上的环形振荡器(ROs)的频率与黄金模型进行比较来检测回收的fpga。在赛灵思fpga上的实验结果表明,Phase I可以正确地对20个被测fpga中的8个进行分类。然而,阶段I未能检测到fpga在快速弯道和较少的先前使用。然后用第二阶段来补充第一阶段并克服其局限性。第二阶段对可疑的fpga执行一个简短的老化步骤,并利用老化速度的降低(由于先前的使用)来覆盖第一阶段遗漏的情况。在我们的硅结果中,第二阶段正确地检测了所有新鲜和回收的fpga。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Aging analysis for recycled FPGA detection
The counterfeit electronic component industry continues to threaten the security and reliability of systems by infiltrating recycled components into the supply chain. With the increased use of FPGAs in critical systems, recycled FPGAs cause significant concerns for government and industry. In this paper, we propose a two phase detection approach to differentiate recycled (used) FPGAs from new ones. Both approaches rely on machine learning via support vector machines (SVM) for classification. The first phase examines suspect FPGAs “as is” while the second phase requires some accelerated aging. To be more specific, Phase I detects recycled FPGAs by comparing the frequencies of ring oscillators (ROs) distributed on the FPGAs against a golden model. Experimental results on Xilinx FPGAs show that Phase I can correctly classify 8 out of 20 FPGAs under test. However, Phase I fails to detect FPGAs at fast corners and with lesser prior usage. Phase II is then used to compliment Phase I and overcome its limitations. The second phase performs a short aging step on the suspect FPGAs and exploits the aging speed reduction (due to prior usage) to cover the cases missed by Phase I. In our silicon results, Phase II detects all the fresh and recycled FPGAs correctly.
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