半导体界面的室温制造

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947419

N. Razek, C. Flötgen, V. Dragoi, M. Wimplinger

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引用次数: 0

摘要

开发了一种新的室温共价键技术。表面制备方法允许就地去除天然氧化物和制造无氧化物键合界面，可直接用于制造各种器件(例如太阳能电池)。

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Room temperature fabrication of semiconductor interfaces

A new technology was developed allowing for room temperature covalent bonding. The surface preparation method allows for in situ native oxides removal and fabrication of oxide-free bonded interfaces which could be directly used in fabrication of various devices (e.g. solar cells).

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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