ALD蜂窝板实现坚固的超薄MEMS

K. Davami, Lin Zhao, I. Bargatin
{"title":"ALD蜂窝板实现坚固的超薄MEMS","authors":"K. Davami, Lin Zhao, I. Bargatin","doi":"10.1109/MEMSYS.2014.6765673","DOIUrl":null,"url":null,"abstract":"This paper reports rigid MEMS structures made of ALD films, which had thicknesses as low as 10 nanometers and were patterned in the shape of a 3D honeycomb. Hexagonal honeycomb lattices offer a dramatically higher flexural stiffness compared to that of planar films, allowing us to fabricate large-area suspended devices without significant warping. Both alumina (Al2O3) and silica (SiO2) structures were fabricated, each presenting a different set of fabrication challenges. The spring constants of the cantilever structures were measured and compared with the simulation results.","PeriodicalId":312056,"journal":{"name":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"ALD honeycomb plates enabling robust ultrathin MEMS\",\"authors\":\"K. Davami, Lin Zhao, I. Bargatin\",\"doi\":\"10.1109/MEMSYS.2014.6765673\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports rigid MEMS structures made of ALD films, which had thicknesses as low as 10 nanometers and were patterned in the shape of a 3D honeycomb. Hexagonal honeycomb lattices offer a dramatically higher flexural stiffness compared to that of planar films, allowing us to fabricate large-area suspended devices without significant warping. Both alumina (Al2O3) and silica (SiO2) structures were fabricated, each presenting a different set of fabrication challenges. The spring constants of the cantilever structures were measured and compared with the simulation results.\",\"PeriodicalId\":312056,\"journal\":{\"name\":\"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-03-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2014.6765673\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2014.6765673","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文报道了由ALD薄膜制成的刚性MEMS结构,其厚度低至10纳米,并以3D蜂窝的形状进行图案设计。与平面薄膜相比,六边形蜂窝晶格提供了显着更高的弯曲刚度,使我们能够制造大面积悬浮器件而不会产生明显的翘曲。氧化铝(Al2O3)和二氧化硅(SiO2)结构都是制造出来的,每种结构都有不同的制造挑战。测量了悬臂结构的弹性常数,并与仿真结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ALD honeycomb plates enabling robust ultrathin MEMS
This paper reports rigid MEMS structures made of ALD films, which had thicknesses as low as 10 nanometers and were patterned in the shape of a 3D honeycomb. Hexagonal honeycomb lattices offer a dramatically higher flexural stiffness compared to that of planar films, allowing us to fabricate large-area suspended devices without significant warping. Both alumina (Al2O3) and silica (SiO2) structures were fabricated, each presenting a different set of fabrication challenges. The spring constants of the cantilever structures were measured and compared with the simulation results.
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