SSL模块基于聚合物的2D/3D晶圆级异构集成

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2012-04-16 DOI:10.1109/ESIME.2012.6191808

C. Yuan, Jia Wei, H. Ye, S. Koh, S. Harianto, M. van den Nieuwenhof, G. Zhang

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引用次数: 2

摘要

本文演示了固态照明(SSL)模块的异构集成，包括光源(LED)和驱动/控制组件。这种集成是通过基于聚合物的晶圆级封装技术实现的，并且这种结构已经原型化和测试。本文还将介绍结构设计，热设计考虑，材料选择和工艺技术以及机械挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

This paper demonstrates a heterogeneous integration of solid state lighting (SSL) module, including light source (LED) and driver/control components. Such integration has been realized by the polymer-based reconfigured wafer level package technologies and such structure has been prototyped and tested. The structure design, thermal design consideration, material selection & process technologies, and mechanical challenges will be also described in this paper.

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来源期刊

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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