采用全湿蚀刻工艺形成三台面的高可靠性和可重复性InGaAs/InP双异质结双极晶体管

M. Yanagisawa, Masataka Watanabe, T. Kawasaki, Hirohiko Kobayashi, K. Kotani, R. Yamabi, Y. Tosaka, D. Fukushi
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引用次数: 1

摘要

作者已经成功地制造了一种适用于基于inp的双异质结双极晶体管的稳健制造工艺。该工艺采用全湿法刻蚀法形成三台面结构,具有较高的重现性和可靠性。在130片晶圆中,电流增益的变化为4.6%,结温为100℃时的平均失效时间超过4 × 106小时,其判据为电流增益变化5%。这些优异的结果表明,我们在基材表面有InP钝化层的DHBT结构和我们的全湿台面形成工艺足以应用于集成电路的制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Highly-reliable and reproducible InGaAs/InP double heterojunction bipolar transistor utilizing all-wet etching process for triple mesa formation
The authors have succeeded in making a robust fabrication process applied to InP-based double heterojunction bipolar transistors. The process, featuring all-wet etching method for formation of triple-mesa structure, has shown markedly high reproducibility and reliability. The variation of the current gain has been 4.6% through 130 wafers, and the mean time to failure at the junction temperature of 100°C has been longer than 4 × 106 hours, whose criterion is a 5% change in current gain. These excellent results show that our structure of DHBT, which has an InP passivation layer on the surface of the base layer, and our all-wet mesa formation process, are sufficient to be applied to the manufacturing of integrated circuits.
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