低温金属-金属键合的异质集成和性能缩放

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947438

M. Goorsky, K. Schjølberg-Henriksen, B. Beekley, N. Marathe, K. Mani, A. Bajwa, S. Iyer

{"title":"低温金属-金属键合的异质集成和性能缩放","authors":"M. Goorsky, K. Schjølberg-Henriksen, B. Beekley, N. Marathe, K. Mani, A. Bajwa, S. Iyer","doi":"10.23919/LTB-3D.2017.7947438","DOIUrl":null,"url":null,"abstract":"Au-Au based interconnect bonding (and Cu-Cu bonding) is advanced by addressing the roles of initial surface roughness, chemical mechanical polishing, bonding pressure and temperature. Focused ion beam sectioning through the bonded interface is used to determine grain growth, void evolution, and void faceting.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Low temperature metal-metal bonding for heterogeneous integration and performance scaling\",\"authors\":\"M. Goorsky, K. Schjølberg-Henriksen, B. Beekley, N. Marathe, K. Mani, A. Bajwa, S. Iyer\",\"doi\":\"10.23919/LTB-3D.2017.7947438\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Au-Au based interconnect bonding (and Cu-Cu bonding) is advanced by addressing the roles of initial surface roughness, chemical mechanical polishing, bonding pressure and temperature. Focused ion beam sectioning through the bonded interface is used to determine grain growth, void evolution, and void faceting.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947438\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947438","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

通过解决初始表面粗糙度、化学机械抛光、键合压力和温度的作用，提出了基于Au-Au的互连键合(和Cu-Cu键合)。通过键合界面的聚焦离子束切片用于确定晶粒生长、空洞演化和空洞面化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Low temperature metal-metal bonding for heterogeneous integration and performance scaling

Au-Au based interconnect bonding (and Cu-Cu bonding) is advanced by addressing the roles of initial surface roughness, chemical mechanical polishing, bonding pressure and temperature. Focused ion beam sectioning through the bonded interface is used to determine grain growth, void evolution, and void faceting.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

自引率

0.00%

发文量