用于三维集成的铜-介电非均质键合

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886145

Wei Lin, Juntao Li, J. Washington, David Rath, S. Skordas, T. Kirihata, K. Winstel, B. Peethala, J. Demarest, D. Song, D. Edelstein, S. Iyer

{"title":"用于三维集成的铜-介电非均质键合","authors":"Wei Lin, Juntao Li, J. Washington, David Rath, S. Skordas, T. Kirihata, K. Winstel, B. Peethala, J. Demarest, D. Song, D. Edelstein, S. Iyer","doi":"10.1109/LTB-3D.2014.6886145","DOIUrl":null,"url":null,"abstract":"A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding.","PeriodicalId":123514,"journal":{"name":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Copper-to-dielectric heterogeneous bonding for 3D integration\",\"authors\":\"Wei Lin, Juntao Li, J. Washington, David Rath, S. Skordas, T. Kirihata, K. Winstel, B. Peethala, J. Demarest, D. Song, D. Edelstein, S. Iyer\",\"doi\":\"10.1109/LTB-3D.2014.6886145\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding.\",\"PeriodicalId\":123514,\"journal\":{\"name\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-07-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D.2014.6886145\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D.2014.6886145","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}