{"title":"利用磁显微镜和锁定红外热成像技术定位模具和封装中的电短路","authors":"M. Hechtl, G. Steckert, C. Keller","doi":"10.1109/IPFA.2006.251041","DOIUrl":null,"url":null,"abstract":"Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results","PeriodicalId":283576,"journal":{"name":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography\",\"authors\":\"M. Hechtl, G. Steckert, C. Keller\",\"doi\":\"10.1109/IPFA.2006.251041\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results\",\"PeriodicalId\":283576,\"journal\":{\"name\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2006.251041\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2006.251041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography
Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results