多层金属封装电源器件异常热响应失效分析

Yulong Zhang, Lulu Wang, Bo Gao, Lixin Wang, Jiajun Luo
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引用次数: 0

摘要

由于多层结构的性质及其金属特性,采用常规技术很难对具有异常热特性的多层金属封装功率器件进行失效分析。为了克服这一挑战,提出了一种系统的解决方案。首先,通过电学试验和对二极管正向电压$(V_{\ mathm {SD}})$曲线的分析,确定功率器件热响应异常的失效原因是散热问题。其次,通过结构功能分析和X-CT测试,确定了电力设备的具体故障部位;最后通过物理失效分析技术对失效部位进行分析,并通过显微观察和能谱分析对具体失效原因进行验证和进一步分析。结果表明,后金属化氧化导致焊料空洞的形成,从而导致上述失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Failure Analysis of Multilayer-Metal-Packaged Power Devices for Abnormal Thermal Response
Because of the nature of multilayered structure and their metal characteristics, it is difficult to conduct failure analysis on multilayer-metal-packaged power devices with abnormal thermal characteristics using conventional techniques. In order to overcome this challenge, a systematic solution is proposed. Firstly, the failure cause of abnormal thermal response for power devices is identified as the problem of heat dissipation through electrical tests and analysis of diode forward voltage $(V_{\mathrm{SD}})$ curves. Secondly, specific failure sites of power devices were located by the structure function analysis and the X-CT test. Finally, the failure site was analyzed by physical failure analysis techniques, and the specific failure cause was validated and further analyzed by microscopic observations and EDS. It was found that the oxidation of back metallization led to the formation of solder voids which resulted in the above failure.
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