“超越摩尔”的范式

G.Q. Zhang, F. van Roosmalen, M. Graef
{"title":"“超越摩尔”的范式","authors":"G.Q. Zhang, F. van Roosmalen, M. Graef","doi":"10.1109/ICEPT.2005.1564646","DOIUrl":null,"url":null,"abstract":"Microelectronics has pervaded our lives for the past fifty years, with massive penetration into health, mobility, security, communications, education, entertainment, and virtually every aspect of human lives. In the past decades, as the main stream, these progresses are powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano dimension, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there are ever-increasing awareness, R&D effort and business drivers to push the development and application of \"more than Moore\" (MtM) that are based upon or derived from silicon technologies but do not scale with Moore's law (with typical examples as RF, power, sensor and actuator, SiP, heterogeneous integration, etc.). This emerging trend is partially trigged by the increasing social needs for high level system integration including non-digital functionalities, the necessity to broaden the product portfolio of existing wafer fabs, and the limiting economic and time factors of advanced SoC development. Starting from the rationale of MtM, this paper will highlight some strategic research subjects for the major \"MtM\" related technology building blocks. Some issues related to the paradigm of MtM, covering industrial vision, strategy and business models, will also be discussed.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"44","resultStr":"{\"title\":\"The paradigm of \\\"more than Moore\\\"\",\"authors\":\"G.Q. Zhang, F. van Roosmalen, M. Graef\",\"doi\":\"10.1109/ICEPT.2005.1564646\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Microelectronics has pervaded our lives for the past fifty years, with massive penetration into health, mobility, security, communications, education, entertainment, and virtually every aspect of human lives. In the past decades, as the main stream, these progresses are powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano dimension, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there are ever-increasing awareness, R&D effort and business drivers to push the development and application of \\\"more than Moore\\\" (MtM) that are based upon or derived from silicon technologies but do not scale with Moore's law (with typical examples as RF, power, sensor and actuator, SiP, heterogeneous integration, etc.). This emerging trend is partially trigged by the increasing social needs for high level system integration including non-digital functionalities, the necessity to broaden the product portfolio of existing wafer fabs, and the limiting economic and time factors of advanced SoC development. Starting from the rationale of MtM, this paper will highlight some strategic research subjects for the major \\\"MtM\\\" related technology building blocks. Some issues related to the paradigm of MtM, covering industrial vision, strategy and business models, will also be discussed.\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"44\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564646\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 44

摘要

在过去的五十年里,微电子已经渗透到我们的生活中,大规模渗透到健康、移动、安全、通信、教育、娱乐以及人类生活的几乎每一个方面。在过去的几十年里,作为主流,这些进步是由摩尔定律驱动的,主要有两个发展领域,即集成电路小型化到纳米尺寸,以及基于SoC的系统集成。当微电子社区继续在世界各地发明新的解决方案以保持摩尔定律的活力时,有越来越多的意识,研发工作和业务驱动因素推动“超越摩尔”(MtM)的开发和应用,这些技术基于或衍生于硅技术,但不符合摩尔定律(典型的例子是射频,电源,传感器和执行器,SiP,异构集成等)。这一新兴趋势的部分原因是社会对高水平系统集成(包括非数字功能)的需求不断增加,扩大现有晶圆厂产品组合的必要性,以及先进SoC开发的经济和时间因素的限制。本文将从MtM的基本原理出发,重点介绍与“MtM”相关的主要技术构建模块的一些战略研究课题。与MtM范例相关的一些问题,包括工业愿景、战略和商业模式,也将被讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The paradigm of "more than Moore"
Microelectronics has pervaded our lives for the past fifty years, with massive penetration into health, mobility, security, communications, education, entertainment, and virtually every aspect of human lives. In the past decades, as the main stream, these progresses are powered by Moore's law, with two focused development arenas, namely, IC miniaturization down to nano dimension, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore's law alive, there are ever-increasing awareness, R&D effort and business drivers to push the development and application of "more than Moore" (MtM) that are based upon or derived from silicon technologies but do not scale with Moore's law (with typical examples as RF, power, sensor and actuator, SiP, heterogeneous integration, etc.). This emerging trend is partially trigged by the increasing social needs for high level system integration including non-digital functionalities, the necessity to broaden the product portfolio of existing wafer fabs, and the limiting economic and time factors of advanced SoC development. Starting from the rationale of MtM, this paper will highlight some strategic research subjects for the major "MtM" related technology building blocks. Some issues related to the paradigm of MtM, covering industrial vision, strategy and business models, will also be discussed.
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