铜芯引线框架材料在集成电路封装中的应用

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746710

Koo Kok Kiat, T. Min

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引用次数: 1

摘要

在当今的引线框架IC封装中，引线框架的成本占材料成本的最大部分之一。蚀刻引线框架可以花费总包装成本的50%，而冲压框架可以花费约30%。

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Adaptation of brass core lead frame material in IC packaging

In today's lead frame IC packages, the cost of lead frames account for one of the largest portion of material costs. Etched lead frames can cost 50% of the total package cost where as stamped frames can cost around 30%.

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来源期刊

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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