DRAM设备中数据保留故障的表征

Angelo Bacchini, M. Rovatti, G. Furano, M. Ottavi
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引用次数: 16

摘要

动态随机存取存储器(DRAM)是当今消费市场中使用最广泛的存储器类型,它仍然广泛用于空间应用的大容量存储器。尽管供应商进行了精确的测试以确保高可靠性,但DRAM错误仍然是该领域常见的故障来源。最近的大规模研究报告了DRAM子系统所经历的大多数错误是由于在同一内存地址上重复出现的错误,但仅在特定条件下发生。由于这些故障可能与存储单元保留其存储电荷的能力有关,因此本研究对DRAM数据保留时间进行了经验表征。从两家不同厂商的SDRAM设备中收集了保留时间信息,以评估四种不同因素(温度、数据背景、以前的充电水平和可变保留时间)对DRAM电池保留时间的影响。收集的结果可用于定义增强的测试过程,以便及早发现数据保留错误。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of data retention faults in DRAM devices
Dynamic random access memory (DRAM) is the most widely used type of memory in the consumer market today, and it is still widely used for mass memories for space application. Even though accurate tests are performed by vendors to ensure high reliability, DRAM errors continue to be a common source of failures in the field. Recent large-scale studies reported how most of the errors experienced by DRAM subsystem are due to faults repeating on the same memory address but occurring only under specific condition. As these failures could be related to the memory cell's ability to retain its stored charge, an empirical characterization of DRAM data retention time was performed within this study. Retention time information was collected from SDRAM devices from two different vendors to evaluate the impact of four different factors (temperature, data background, previous charge level and variable retention time) on DRAM cells retention time. Gathered results can be useful in defining enhanced test procedures for the early detection of data retention faults.
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