先进的模块封装方法

P. Salmon
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引用次数: 0

摘要

介于传统印刷电路板技术和晶圆级封装(WLP)之间的中间解决方案是使用LCD制造设备在大型玻璃基板上制造互连电路和倒装芯片组装结构。5微米的迹线宽度和10微米的迹线间距可以在1800/spl倍/1500毫米的柔性基板上实现。显示器和键盘的背板也可以使用薄膜晶体管,tft,为lcd开发并增强了柔性组件(200/spl度/C处理)。柔性电路建立在具有中间释放层的玻璃载体上。在所有处理完成后,包括互连电路,IC芯片组装,测试和返工,载体被丢弃。该组装方法在IC芯片上使用金色螺柱凸起,在主板上填充相应的焊料孔,用于IC芯片,模块电缆和测试连接,间距为100微米。避免层下环氧树脂有助于修复有缺陷的IC芯片的强大能力。这些方法适用于从手机到刀片服务器的各种产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced module packaging method
An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly structures on large glass substrates using LCD manufacturing equipment. Trace widths of 5 microns and a trace pitch of 10 microns are achievable on flexible substrates as large as 1800/spl times/1500 mm. Back planes for displays and keyboards can also utilize thin film transistors, TFTs, as developed for LCDs and enhanced for flexible assemblies (200/spl deg/C processing). A flexible circuit is built on a glass carrier with an intermediate release layer. The carrier is discarded after all processing is complete, including interconnection circuits, IC chip assembly, test and rework. The assembly method uses gold stud bumps on IC chips, and corresponding wells filled with solder on the motherboard 100-micron pad pitch is achievable for IC chips, module cables, and test connections. Avoidance of epoxy under layers contributes to a robust capability for reworking defective IC chips. The methods are applicable to a wide range of products, from cell phones to blade servers.
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