{"title":"积分方程求解器中四边形基近奇异积分的求值","authors":"C. Luo, Giacomo Bianconi, Swagato Chakraborty","doi":"10.1109/EPEPS.2015.7347126","DOIUrl":null,"url":null,"abstract":"The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Evaluation of near-singular integrals for quadrilateral basis in integral equation solver\",\"authors\":\"C. Luo, Giacomo Bianconi, Swagato Chakraborty\",\"doi\":\"10.1109/EPEPS.2015.7347126\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.\",\"PeriodicalId\":130864,\"journal\":{\"name\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2015.7347126\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2015.7347126","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Evaluation of near-singular integrals for quadrilateral basis in integral equation solver
The paper presents an efficient and accurate methodology for evaluating near singular Green's function integrals for 3D boundary element-based full-wave analysis of interconnect structures in IC packages and printed circuit boards using quadrilateral basis function.