{"title":"在器件产量分析中使用测试掩模","authors":"S. J. Rhodes, G.C. Day","doi":"10.1109/ICMTS.1993.292920","DOIUrl":null,"url":null,"abstract":"A product specific test mask is used to analyze circuit yield and associate it with device parameter yield, which can then more easily be related to process failure. Once a consistent failure mode has been identified, it is found that a problem specific test mask is also required to finally effect a solution. An example of this yield diagnosis methodology is described based on a nonvolatile static RAM (SRAM) circuit.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The use of test masks in the analysis of device yields\",\"authors\":\"S. J. Rhodes, G.C. Day\",\"doi\":\"10.1109/ICMTS.1993.292920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A product specific test mask is used to analyze circuit yield and associate it with device parameter yield, which can then more easily be related to process failure. Once a consistent failure mode has been identified, it is found that a problem specific test mask is also required to finally effect a solution. An example of this yield diagnosis methodology is described based on a nonvolatile static RAM (SRAM) circuit.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292920\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292920","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The use of test masks in the analysis of device yields
A product specific test mask is used to analyze circuit yield and associate it with device parameter yield, which can then more easily be related to process failure. Once a consistent failure mode has been identified, it is found that a problem specific test mask is also required to finally effect a solution. An example of this yield diagnosis methodology is described based on a nonvolatile static RAM (SRAM) circuit.<>