减少小型嵌入式ram的测试/维修区域开销

Baosheng Wang, Q. Xu
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引用次数: 13

摘要

对于当前高度集成和内存主导的片上系统(soc),特别是对于图形和网络soc,嵌入式sram (e- sram)的测试/维修区域开销是一个大问题。本文从实际的角度提出了解决这一问题的各种方法。在不牺牲高速可测试性、诊断能力和可修复性的前提下,所提出的方法考虑了相同存储器的部分共享包装器、嵌入不同功能块的e- sram的共享存储器BIST控制器、宽存储器的测试响应压缩以及不同配置的e- sram的各种修复策略。通过结合上述方法,e- sram的测试/维修面积开销可以显着减少。例如,对于我们实验中使用的一个基准SoC,它可以减少整个内存阵列的10%
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Test/Repair Area Overhead Reduction for Small Embedded SRAMs
For current highly-integrated and memory-dominant system-on-a-chips (SoCs), especially for graphics and networking SoCs, the test/repair area overhead of embedded SRAMs (e-SRAMs) is a big concern. This paper presents various approaches to tackle this problem from a practical point of view. Without sacrificing at-speed testability, diagnosis capability and repairability, the proposed approaches consider partly sharing wrapper for identical memories, sharing memory BIST controllers for e-SRAMs embedded in different functional blocks, test responses compression for wide memories, and various repair strategies for e-SRAMs with different configurations. By combining the above approaches, the test/repair area overhead for e-SRAMs can be significantly reduced. For example, for one benchmark SoC used in our experiments, it can be reduced as much as 10% of the entire memory array
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