{"title":"阵列探测卡","authors":"M. Beiley, F. Ichishita, C. Nguyen, S. Wong","doi":"10.1109/MCMC.1992.201439","DOIUrl":null,"url":null,"abstract":"By utilizing conventional IC processing techniques, a membrane probe card has been fabricated on a silicon wafer and its functionality demonstrated. The probe card was able to provide a very large number of probe tips in an array form, permanently fixed in the X-Y plane via a transparent, flexible membrane. The use of an electrical current pulse, instead of a mechanical scrubbing motion, to break down the interfacial oxide has been demonstrated. The contact resistance was about 5*10/sup -5/ Omega -cm/sup 2/. The new probe card offers smaller probe parasitics. The addition of the active test circuitry on the probe card would allow very high speed wafer level testing.<<ETX>>","PeriodicalId":202574,"journal":{"name":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Array probe card\",\"authors\":\"M. Beiley, F. Ichishita, C. Nguyen, S. Wong\",\"doi\":\"10.1109/MCMC.1992.201439\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"By utilizing conventional IC processing techniques, a membrane probe card has been fabricated on a silicon wafer and its functionality demonstrated. The probe card was able to provide a very large number of probe tips in an array form, permanently fixed in the X-Y plane via a transparent, flexible membrane. The use of an electrical current pulse, instead of a mechanical scrubbing motion, to break down the interfacial oxide has been demonstrated. The contact resistance was about 5*10/sup -5/ Omega -cm/sup 2/. The new probe card offers smaller probe parasitics. The addition of the active test circuitry on the probe card would allow very high speed wafer level testing.<<ETX>>\",\"PeriodicalId\":202574,\"journal\":{\"name\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1992.201439\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1992.201439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
By utilizing conventional IC processing techniques, a membrane probe card has been fabricated on a silicon wafer and its functionality demonstrated. The probe card was able to provide a very large number of probe tips in an array form, permanently fixed in the X-Y plane via a transparent, flexible membrane. The use of an electrical current pulse, instead of a mechanical scrubbing motion, to break down the interfacial oxide has been demonstrated. The contact resistance was about 5*10/sup -5/ Omega -cm/sup 2/. The new probe card offers smaller probe parasitics. The addition of the active test circuitry on the probe card would allow very high speed wafer level testing.<>
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