分子束外延生长低温砷化镓中砷沉淀的正电子研究

S. Fleischer, C. Surya, Y.F. Hu, C. Beling, S. Fung, M. Missous
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引用次数: 0

摘要

利用变能慢正电子束,研究了在低衬底温度下分子束外延生长砷化镓。与半绝缘衬底相比,生长的LT-GaAs具有更高的空位相关缺陷浓度(/spl sim/10/sup 17/ cm/sup -3/)。在600℃退火后,正电子S参数的结果表明,砷的沉淀与正电子S的形成有关。表面S参数的降低被认为是由氧气引起的,XPS测量证实了这一点。我们首次使用正电子束检测了铝三角洲层,并发现通过这种方法,铝层可以分解到至少1700 /spl Aring/的深度。退火后S参数的降低表明Al形成了Al/sub x/Ga/sub 1-x/As, Al层的存在抑制了砷的扩散,从而减少了空位缺陷的形成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Positron studies of arsenic precipitation in low-temperature GaAs grown by molecular beam epitaxy
Gallium arsenide grown at low substrate temperature by molecular beam epitaxy has been studied using a variable energy slow positron beam. As-grown LT-GaAs was found to have a higher concentration of vacancy-related defects (/spl sim/10/sup 17/ cm/sup -3/) than the semi-insulating substrate. After annealing at 600/spl deg/C, the positron S parameter results suggest the formation of clusters which we associate with arsenic precipitation. The lowering of the S parameter at the surface was thought to be due to oxygen and this was confirmed by XPS measurements. For the first time, we have examined aluminium delta-layers using a positron beam and found that the Al-layers can be resolved to depths of at least 1700 /spl Aring/ by this method. The lowering of the S parameter after annealing would suggest that the Al forms Al/sub x/Ga/sub 1-x/As, and that the presence of the Al layers may inhibit the diffusion of arsenic, thereby reducing the formation of vacancy-defects.
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